CMP

Application

Semiconductor chemical mechanical planarization (CMP) process

Characteristics

SBB TECH's CMP PART provides the localization of products applied to the semiconductor polishing process and new products through modification and improvement of problems identified by users.

Production Items

- CRESCENT ASS’Y
- IDLER MEGASONIC
- MAGNET ROLLER
- PICKING CYLINDER
- DRIVER CENTER
- PUSHER MAGNET, etc.
- BLUSH BLOCK